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L1 5 turns of 08 mm (20 ga) tinned copper wire, 7 mm long (wound on 5 mm diameter mandrel) Tap at 03 turns Air core, mounted 2 mm above board L2 5 turns of 08 mm (20 ga) enameled copper wire, 9 mm long (wound on 5 mm diameter mandrel) Air core, mounted 2 mm above board L3 5 turns of 08 mm (20 ga) enameled copper wire, 8 mm long (wound on 5 mm diameter mandrel) Air core, mounted 2 mm above board L4 20 turns of 025 mm (30 ga) enameled copper wire, tight wound on 483 mm OD former with F16 tuning slug and shield can RFC1 3 turns of 025 mm (30 ga) enameled copper wire wound on an F29 ferrite bead

When it comes to actual use, WAP works like this: 1 The user selects an option on their mobile device that has a URL with Wireless Markup language (WML) content assigned to it 2 The phone sends the URL request via the phone network to a WAP gateway, using the binary encoded WAP protocol 3 The gateway translates this WAP request into a conventional HTTP request for the specified URL, and sends it on to the Internet 4 The appropriate Web server picks up the HTTP request 5 The server processes the request, just as it would any other request If the URL refers to a static WML file, the server delivers it If a CGI script is requested, it is processed and the content returned as usual 6 The Web server adds the HTTP header to the WML content and returns it to the gateway 7 The WAP gateway compiles the WML into binary form 8 The gateway then sends the WML response back to the phone 9 The phone receives the WML via the WAP protocol 10 The micro-browser processes the WML and displays the content on the screen WAP makes use of the Internet model to provide a flexible service platform However, in order to accommodate wireless access to the information on the Web, WAP has been optimized to meet the restrictions of a wireless environment

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Note that U5 s center pin should be soldered on both sides of the board but take care not to touch either of the two large adjacent electrolytic capacitors with the barrel of your soldering iron Go ahead and mount regulator U4, followed by U22 (TL072) and U3 (LM386) Note that pin 4 on both these devices should be soldered to the copper on the top of the board as well as the bottom The two D3 and D4 are both mounted horizontally, so that they later protrude through matching 3 mm holes in the front panel Note that they are both fitted with their cathode leads towards the left Bend their leads down through 90 about 5 mm from the LED bodies, then solder them in position so that the axis of each LED is 5 mm above the board The final components to be mounted on the PC board include the Dual-Gate MOSFET at Q1 and the SA605D IC at (U1), U2 and transistor Q2 These components should be handled very carefully, using an anti-static wrist-band to avoid static charges building up on the components The two integrated circuits should be mounted in IC sockets IC sockets are an insurance policy against circuit failure at a later date It is much easier to simply unplug a faulty IC, rather than trying to un-solder 14 or 16 pins from the circuit Most people cannot un-solder 16 pins without damaging a circuit board When mounting the IC sockets, observe a small cut-out at one edge of the socket The cut-out will identify the top of the socket Usually pin of the IC will be located to the left of the cut-out Solder the sockets in their respective locations Finally insert the ICs into their respective sockets, noting pin 1 is to the left of the small indented circle or cut-out on the top of the IC package When handling the MOSFET be extremely.

Wireless Markup Language (WML)

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