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Discrete Fourier transform (DFT) (continued) embedded modules on IC, system-on-chip concepts, 634-635 Dispersion relationship, band structure, 152-160 Disturb failures, floating-gate memory arrays, 424-426 Divided word line (DWL) structure, SRAM (static random access memory) architecture, 368-369 DMOS transistors, smart power circuits, 259-261 Dopant control, advanced MOSFET structures, 133-135 Doping profiles: state-of-the-art bulk MOSFET, 132-133 system-on-chip technology limits, systematic and random mismatch, 646 Double-balanced mixer design, CMOS technology, radiofrequency (RF) circuits, 511-513 Double-gated (DG) FET, advanced MOSFET structures, 134-136 Double heterojunction bipolar transistor (DHBT), narrow-bandgap base, 64-65 Double-poly transistor, self-adjusted transistor structures, inside spacer, 53-55 Double solid-phase epitaxy (DSPE) technique, silicon-on-sapphire (SOS) material, 223 Drain capacitance: floating-gate memory arrays, NAND cell, 414-417 SOI MOSFET, 230 Drain current models: digital switching, CMOS technology, static inverter, 480-481 first-order MOSFET models: one-dimensional drain current model, 75-76 strong inversion approximation, 79-82 high-speed digital applications, noise parameters, 609-616 MOSFET parasitic effects: gate-induced drain leakage (GIDL), 119-124 output resistance, 128-130 MOSFETs, short-channel effects, 89-97 Drain engineering: hot-carrier structure, 311 -312 MOSFET parasitic effects, hot carriers, 118-119 Drain extension, byte-alterable E2PROMs, floating-gate tunnel oxide (FLOTOX), 402-406 Drain-induced barrier lowering (DIBL): high-speed digital applications, short-channel effects (SCE), 556

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You can prevent a feature from automatically combining with other bodies by deselecting the Merge Result option. This holds true between features, but not across all bodies in a part. For example, if an extrude feature uses the Merge result option, all the bodies that it touches become merged together, but if the original extrude feature does not touch a body, it will not be merged. This option is shown in Figure 26.15 and is found on all features that create new solid bodies except for the Patterns, Rib, and Move/Copy Bodies features.

One of the first questions new users tend to ask is how to turn off the grid in sketches. This is a bit ironic, since the grid is most useful for new users mainly to help them keep track of when they are in or out of sketch mode. The Grid/Snap options are shown in Figure B.67.

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The last options apply only when backing up to tape: NoFormat/Format: Will format the tape (not the disk drive!) prior to the backup. Format automatically includes skip and init. Rewind/NoRewind: Directs SQL Server to rewind the tape. The default is to rewind. UnLoad/Load: Automatically rewinds and unloads the tape. This is the default until the user session specifies load. Restart: If a multi-tape backup fails in the middle of the backup (a tape breaks, for example), the Restart option will continue the backup sequence in midstream without having to go back to the first tape. This option can save time, but be sure to run a restore verifyonly (see next topic) after the backup to be sure.

They are the parts with advantages of small size, cost-ef ciency, and reliability in the implementation of the circuit module or system, Even in a module or system replaced by IC chips, the zero chip capacitor must be applied in the testing. The chip inductor is very often applied as an off-chip part because the Q value of an on-chip inductor is too low.

1. Create an assembly, and add the target part to it. The target part is the one that the Smart Component will be mated to and the one that will have the in-context cut-out inserted into it. In this case, the target part is a sheet metal box.

minimize asymptotic variance; but for nuisance parameters, it is more important to keep their bias small. We have already commented on this in Section 5.1, and there will be more remarks in Section 11.1. Sections 6.2 and 6.3 give some very general results (without proofs) on consistency and asymptotic normality of multiparameter M-estimates. The remaining sections are concerned with simultaneous estimates of location and scale (the latter being considered as a nuisance parameter), and with Studentizing. Breakdown properties of multidimensional Ill-estimates will be discussed in 11, in particular in Section 11.2.2.

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